| ‘? I G|1401, G|1402, G|1403, G|14047 Www'V'Shay'C°m Vishay General Semiconductor THERMAL cHARAcTERIsTIcs (TA = 25 00 unless otherwise noted) PARAMETER Typical thermal resistance ‘W2’ N atesU) Thermal resistance from junction to ambient in free air, no neatsink(2) Thermal resistance from junction to case and ambient mounted on heatsink PREFERRED P/N UNIT WEIGHT (9) GI14o1-E3/45 1:31 GI14o1HEs/45(1) 1:31 Note(i) AEC-Q101 qumnied RATINGS AND cHARAcTERIsTIcs cuRvEs (TA = 25 cc unless otherwise noted) I2 100 I0 :3 Pulse Width : aoo us1 % Duty Cycle Instantaneous Forward Current (A) :3 Average Forward Rectitied Current (A) m not Case Temperature (°C) Instantaneous Forward Voltage (V) Fig. 1 - Max. Forward Current Derating Curve Fig. 3 - Typical Instantaneous Forward Characteristics I50 mo TC : 125 “C g '25 5.3 ms Single Hall slnewave 3 E 29 g toE J 8 I00 3 A e a (3 75 § E T s 3 S 50 3 o5 E u- E o I E e0 0.01 N E Number of Cycles at 60 HZ Percent of Rated Peak Reverse Voltage (%) Fig. 2 - Max. Non-Repetitive Peak Forward Surge Current Fig. 4 - Typical Reverse Leakage Characteristics Revision: 20?Aug—13 2 Document Number: 88623 For technical questions within your region: DiodesAmericas@vishay.Com, DiodesAsia@vishay.Com, DiodesEurope@vishay.Com THIS DOCUMENT IS SUBJECT To CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vIshay.com/doo?91000 |